BZX84C2V4S - BZX84C39S
DUAL 200mW SURFACE MOUNT ZENER DIODE
Features
• Planar Die Construction
• 200mW Power Dissipation
• Zener Voltages from 2.4V - 39V
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
NCC
1
A
1
A
2
C
2
NC
Top View
Device Schematic
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage @ I
F
= 10mA V
F
0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
200 mW
Thermal Resistance, Junction to Ambient Air (Note 1)
R
θ
JA
625
°C/W
Operating and Storage Temperature Range
T
J,
T
STG
-65 to +150
°C
Notes: 1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BZX84C2V4S - BZX84C39S
Document number: DS30108 Rev. 17 - 2
1 of 4
www.diodes.com
May 2008
© Diodes Incorporated
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