Diodes 2DB1424R Manuel d'utilisateur

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2DB1424R
PNP SURFACE MOUNT TRANSISTOR
Features
Epitaxial Planar Die Construction
Complementary NPN Type Available (2DD2150)
Ideally Suited for Automated Assembly Processes
Ideal for Medium Power Switching or Amplification Applications
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Mechanical Data
Case: SOT89-3L
Case Material: Molded Plastic, "Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish — Matte Tin annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.072 grams (approximate)
NEW PRODUCT
SOT89-3L
3
1
2,4
C
O
L
L
E
C
T
O
R
E
M
I
T
T
E
R
B
A
S
E
4
3
2
1
C
C
B
E
T
O
P
V
I
E
W
Schematic and Pin Configuration
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage
V
CBO
-20 V
Collector-Emitter Voltage
V
CEO
-20 V
Emitter-Base Voltage
V
EBO
-6 V
Peak Pulse Current
I
CM
-5 A
Continuous Collector Current
I
C
-3 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 3) @ T
A
= 25°C P
D
1 W
Thermal Resistance, Junction to Ambient Air (Note 3) @ T
A
= 25°C
R
θ
JA
125 °C/W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150 °C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Conditions
OFF CHARACTERISTICS (Note 4)
Collector-Base Breakdown Voltage
V
(BR)CBO
-20
V
I
C
= -50μA, I
E
= 0
Collector-Emitter Breakdown Voltage
V
(BR)CEO
-20
V
I
C
= -1mA, I
B
= 0
Emitter-Base Breakdown Voltage
V
(BR)EBO
-6
V
I
E
= -50μA, I
C
= 0
Collector Cut-Off Current
I
CBO
-0.1
μA
V
CB
= -20V, I
E
= 0
Emitter Cut-Off Current
I
EBO
-0.1
μA
V
EB
= -5V, I
C
= 0
ON CHARACTERISTICS (Note 4)
Collector-Emitter Saturation Voltage
V
CE(SAT)
-0.18 -0.5 V
I
C
= -2A, I
B
= -0.1A
DC Current Gain
h
FE
180
390
V
CE
= -2V, I
C
= -0.1A
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
C
obo
28
pF
V
CB
= -10V, I
E
= 0,
f = 1MHz
Current Gain-Bandwidth Product
f
T
220
MHz
V
CE
= -2V, I
E
= 0.1A,
f = 100MHz
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB; pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle 2%.
DS31329 Rev. 2 - 2
1 of 4
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2DB1424R
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Résumé du contenu

Page 1 - 2DB1424R

2DB1424R PNP SURFACE MOUNT TRANSISTOR Features • Epitaxial Planar Die Construction • Complementary NPN Type Available (2DD2150) • Ideally Suited

Page 2 - NEW PRODUCT

00.20.425 5075100 125150P, POWER DISSIPATION (W)DT , AMBIENT TEMPERATURE (°C)Fig. 1 Power Dissipation vs. Ambient Temperature (Note 3)A0.60.81.00

Page 3 - (Top View)

0.1 1 10 100CiboCobo I , EMITTER CURRENT (mA)EFig. 8 Typical Gain-Bandwidth Product vs. Emitter Current0501001502002500102030405060708090100V = -

Page 4 - Suggested Pad Layout

Suggested Pad Layout 3.00.92.70.41.71.31.9Unit: mm NEW PRODUCT IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserv

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