Diodes AP8800 Manuel d'utilisateur télécharger pdf (Page 3)

AP8800

Document number: DS31764 Rev. 7 - 2

3 of 13

www.diodes.com

August 2012

P8800

Recommended Operating Conditions (@T

= +25°C, unless otherwise specified.)

mbol Parameter Min Max Unit

Operating Input Voltage relative to GND 8.0 28 V

CTRLDC

Voltage Range for 24% to 200% DC Dimming Relative to GND (Note 2) 0.3 2.5 V

CTRLL

Voltage Low for PWM Dimming Relative to GND 0 0.2 V

OSC

Maximum Switching Frequency 500 kHz

Ambient Temperature Range -40 +85 °C

Duty Cycle Using Inductor ≥ 100µH (Note 3) 0.1 0.95

ENH

CTRL Input Voltage to Attain 100% LED Current 1.25

ENL

CTRL Input Voltage Below Which Device Turns Off 0.2

Notes: 2. For 100% brightness either leave floating or connect to 1.25V relative to GND.

3. For most applications the LED current will be within 8% over the duty cycle range specified. Duty cycle accuracy is also dependent on propagation

delay. Smaller size inductors can be used but LED current accuracy may be greater than 8% at extremes of duty cycle. This is most noticeable at low

duty cycles (less than 0.1) or when the input voltage is high and only one LED is being driven.

Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

Symbol Parameter Conditions Min Typ Max Unit

OUT

Continuous Switch Current (Note 4) — — 350 mA

Quiescient Current — 20 30 μA

THD

Internal Current Sense Threshold Voltage V

– V

SET

92 100 108 mV

REF

Internal Reference Voltage — 1.25 — V

SET SET Pin Input Current V

SET

= V

-0.1 — 1.3 — μA

(on) On-Resistance of Internal Switch — 1.7 2.2 Ω

SW_Leakage

Switch Pin Leakage Current — — 5 μA

Thermal Resistance Junction-to-Ambient

SO-8 (Note 5) — 92 —

°C/W

MSOP-8 (Note 5) —

120

—

°C/W

U-DFN3030-10 (Note 5) —

—

°C/W

Thermal Resistance Junction-to-Case

SO-8 (Note 5) —

—

°C/W

MSOP-8 (Note 5) —

—

°C/W

U-DFN3030-10 (Note 5) —

—

°C/W

Notes: 4. Refer to figure 8 for the device derating curve.

5. Test condition for SO-8, MSOP-8 and U-DFN3030-10: Device mounted on FR-4 PCB, 2”x 2”, 2oz copper, minimum recommended pad layout on

top layer and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.

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Diodes AP8800 Manuel d'utilisateur Page 3

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