Diodes ZXGD3003E6 Manuel d'utilisateur Page 3

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ZXGD3003E6
Issue 2 - October 2007 3 www.zetex.com
© Zetex Semiconductors plc 2007
Absolute maximum ratings
Thermal resistance
NOTES:
(a) For a device surface mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper,
in still air conditions.
(b) For device with two active dice running at equal power.
(c) Pulse width <=300us limit repetition rate to comply with maximum junction temperature.
Parameter Symbol Limit Unit
Supply voltage V
CC
40 V
Input voltage V
IN
40 V
Peak sink current
(c)
I
(sink)PK
5A
Source current @ I
IN1
+ I
IN2
=10mA
(a)
I
(source)
1.6 A
Sink current @ I
IN1
+ I
IN2
=10mA
(a)
I
(sink)
1.4 A
Input current
(c)
I
IN1,
I
IN2
1A
Power dissipation at T
A
=25°C
(a)(b)
P
D
1.1 W
Linear derating factor 8.8 mW/°C
Operating and storage temperature range T
j
, T
stg
-55 to +150
°C
Parameter Symbol Value Unit
Junction to ambient
(a)(b)
R
JC
113 °C/W
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