D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
2 of 5
www.diodes.com
April 2014
© Diodes Incorporated
D58V0M4U8MR
NEW PRODUCT
ADVANCED INFORMATION
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.), Per Element
Characteristic Symbol Value Unit Conditions
Peak Pulse Power Dissipation
P
PP
2700 W 8/20µs, Per Figure 1
Peak Pulse Current
I
PP
24 A 8/20µs, Per Figure 1
ESD Protection – Contact Discharge
V
ESD_Contact
±30 kV IEC 61000-4-2 Standard
ESD Protection – Air Discharge
V
ESD_Air
±30 kV IEC 61000-4-2 Standard
Thermal Characteristics
Characteristic Symbol Value Unit
Package Power Dissipation (Note 5)
P
D
1.0 W
Thermal Resistance, Junction to Ambient (Note 5)
R
θJA
125 °C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150 °C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Standoff Voltage
V
RWM
— — 58 V —
Channel Leakage Current (Note 6)
I
RM
— — 0.2 μA
V
RWM
= 58V
Breakdown Voltage
V
BR
64.4 — 71.2 V
I
R
= 1mA
Clamping Voltage
V
CL
— — 100 V
I
PP
= 24A, t
p
= 8/20μS
Channel Input Capacitance
C
T
— 55 — pF
V
R
= 50V, f = 1MHz
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
0
t, TIME ( s)
Figure 1 Pulse Waveform
20 40
60
100
50
0
Peak Value I
pp
Half Value I /2
pp
8x20 Waveform
as defined by R.E.A.
I , PEAK PULSE CURRENT (%I )
PppP
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150 175
T (°C)
Figure 2 Peak Power Dissipation vs.
Initial
J
Junction Temperature
(
I
I
IAL)/ °
)
PP J PP J
(
I
I
IAL
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