Diodes 74LVC2G04 Manuel d'utilisateur télécharger pdf (Page 4)

74LVC2G04

Document number: DS35160 Rev. 5 - 2

4 of 12

www.diodes.com

October 2013

NEW PRODUCT

74LVC2G04

Electrical Characteristics

Symbol Parameter Test Conditions

-40°C to +85°C -40°C to +125°C

Min Max Min Max Unit

High-Level Output

Voltage

= -100μA

1.65V to 5.5V

– 0.1

= -4mA

1.65V 1.2 0.95

= -8mA

2.3V 1.9 1.7

= -16mA

2.4 1.9

= -24mA

2.3 2.0

= -32mA

4.5V 3.8 3.4

Low-Level Output

Voltage

= 100μA

1.65V to 5.5V 0.1 0.1

= 4mA

1.65V 0.45 0.70

= 8mA

2.3V 0.3 0.45

= 16mA

0.4 0.60

= 24mA

0.55 0.80

= 32mA

4.5V 0.55 0.80

Input Current

= 5.5V or GND

0 to 5.5V ± 5 ± 20 μA

OFF

Power Down Leakage

Current

or V

= 5.5V

0 ± 10 ± 20 μA

Supply Current

= 5.5V or GND

= 0

1.65V to 5.5V 10 40 μA

ΔI

Additional Supply

Current

Input at V

-0.6V

3V to 5.5V 500 5000 μA

Package Characteristics (All typical values are at V

= 3.3V, T

= 25°C.)

Symbol Parameter Package Conditions Min Typ Max Unit

Input Capacitance Typical of all packages

Vcc = 3.3V

= V

– or GND

3.5 pF

Thermal Resistance

Junction-to-Ambient

SOT26

(Note 6)

204

°C/W

SOT363 371

X2-DFN1410-6 430

X2-DFN1409-6 450

X2-DFN1010-6 510

Thermal Resistance

Junction-to-Case

SOT26

(Note 6)

°C/W

SOT363 143

X2-DFN1410-6 190

X2-DFN1409-6 225

X2-DFN1010-6 250

Note: 6. Test condition for SOT26, SOT363, X2-DFN1410-6, X2-DFN1409-6 and X2-DFN1010 -6: Device mounted on FR-4 substrate PC board, 2oz

copper with minimum recommended pad layout.

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Diodes 74LVC2G04 Manuel d'utilisateur Page 4

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