Diodes 74LVC1G08 Manuel d'utilisateur télécharger pdf (Page 6)

74LVC1G08

Document number: DS32199 Rev 7 - 2

6 of 15

www.diodes.com

March 2014

NEW PRODUCT

74LV

Package Characteristics

Symbol Parameter Test Conditions

Min Typ. Max Unit

Thermal Resistance

Junction-to-Ambient

SOT25

(Note 9)

—

204

—

°C/W

SOT353

—

371

—

SOT553

—

231

—

X2-DFN0808-4

—

400

—

X1-DFN1010-6

—

435

—

X2-DFN1010-6

—

445

—

X2-DFN1409-6

—

470

—

X2-DFN1410-6

—

460

—

Thermal Resistance

Junction-to-Case

SOT25

(Note 9)

—

°C/W

SOT353

—

143

—

SOT553

—

105

—

X2-DFN0808-4

—

225

—

X1-DFN1010-6

—

250

—

X2-DFN1010-6

—

250

—

X2-DFN1409-6

—

275

—

X2-DFN1410-6

—

265

—

Note: 9. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

Switching Characteristics

Figure 1 Typical Values at T

= +25°C and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V.

Parameter

From

Input

Output

= -40°C to +85°C T

= -40°C to +125°C

Unit

Min Typ. Max Min Max

A or B Y

1.8V ± 0.15V 1.0 3.4 8.0 1.0 10.5

2.5V ± 0.2V 0.5 2.2 5.5 0.5 7.0

2.7V 0.5 2.5 5.5 0.5 7.0

3.3V ± 0.3V 0.5 2.1 4.5 0.5 6.0

5.0V ± 0.5V 0.5 1.7 4.0 0.5 5.5

Operating Characteristics

= +25°C

Parameter

Test

Conditions

= 1.8V V

= 2.5V V

= 3.3V V

= 5V

Unit

Typ. Typ. Typ. Typ.

Power Dissipation

Capacitance

f = 10MHz 16 16 16 16 pF

1 2 3 4 5 6 7 8 9 10 11 ... 14 15

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Diodes 74LVC1G08 Manuel d'utilisateur Page 6

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